Sr Manager/manager, Advanced Packaging Technology Development
Micron Technology
Not specified (assumed hybrid based on industry standards)
8+ years semiconductor process experience
Wafer bonding and warpage control expertise
Python r sql statistical analysis proficiency
Micron Technology is seeking a Sr Manager/Manager for its Advanced Packaging Technology Development (APTD) team, focusing on delivering high-performing and cost-effective advanced packaging solutions. The ideal candidate will have extensive experience in semiconductor processes, technical leadership, and data analytics proficiency to enhance organizational strategies and compliance
Job Summary
The role involves developing and communicating advanced packaging technology development strategies aligned with organizational objectives.
Candidates must demonstrate technical leadership in setting fiscal year objectives while ensuring high-quality, cost-effective solutions.
The position requires strong data analytics capabilities to support SPC, DOE, and defect analysis within the semiconductor industry.
Matching Summary
Match Score: 85
Micron Technology is seeking a Sr Manager/Manager for its Advanced Packaging Technology Development (APTD) team, focusing on delivering high-performing and cost-effective advanced packaging solutions. The ideal candidate will have extensive experience in semiconductor processes, technical leadership, and data analytics proficiency to enhance organizational strategies and compliance.
Skills & Requirements
Must-have
8+ years semiconductor process experience
Wafer bonding and warpage control expertise
Python R SQL statistical analysis proficiency
FDC RMS equipment control systems knowledge
SPC DOE defect analysis capabilities
Nice-to-have
Visual Basic automation experience
Multi-functional team leadership skills
Mentoring and performance appraisal ability
Strategic alignment with company direction
Continuous learning and growth mindset
Key Requirements
B.S./M.S./Ph.D. in Materials Science or related field
8+ years in semiconductor process or equipment engineering
Experience with wafer bonding and plating processes