Advanced Packaging Process Integration Principal/ Staff Engineer
Applied Materials Inc
Singapore, Singapore
Hybrid
7+ years semiconductor processing experience
Cleanroom environment hands-on experience
2.5d/3d process technology development
This role involves developing integrated process modules for advanced packaging technologies targeting mobile, IoT, and high-performance computing markets
Job Summary
This role involves developing integrated process modules for advanced packaging technologies targeting mobile, IoT, and high-performance computing markets.
The successful candidate will lead risk assessments, gap analyses, and project execution to bring cutting-edge packaging solutions from concept to mass production.
Applied Materials offers a supportive work culture that encourages continuous learning, professional growth, and collaboration with globally recognized R&D teams.
Matching Summary
This role involves developing integrated process modules for advanced packaging technologies targeting mobile, IoT, and high-performance computing markets.
Skills & Requirements
Must-have
7+ years semiconductor processing experience
Cleanroom environment hands-on experience
2.5D/3D process technology development
Through-Silicon Via and Hybrid Bonding knowledge
Design of experiment methodology application
Wafer lot management and metrology data analysis
STEM Bachelor, Master, or Doctorate degree
Nice-to-have
Front-end or Back-end of Line experience
Flip-chip and singulation process knowledge
Cross-functional collaboration skills
Global stakeholder communication abilities
High-density interconnect understanding
Mechanical and thermal reliability expertise
Key Requirements
Bachelor, Master, or Doctorate in STEM disciplines
Minimum 7 years of hands-on semiconductor experience
Deep knowledge of BEOL and packaging assembly unit processes