Technologist, Advanced Packaging Director

Applied Materials Inc

Austin, TX, US
Base: $176,000.00 - $242,000.00; bonus/equity: eli...
Master's or phd in engineering or materials science
10 years experience with master's or 5 with phd
Expertise in 2.xd packaging technologies like foplp
This role leads complex technology projects to develop next-generation 2.xD packaging concepts and architectures

Job Summary

  • This role leads complex technology projects to develop next-generation 2.xD packaging concepts and architectures.
  • The position requires defining end-to-end process flows for panel-level packaging while ensuring seamless integration across large form factor substrates.
  • Candidates will partner with customers to define specifications and contribute to equipment product strategy through process and hardware feedback.

Matching Summary

This role leads complex technology projects to develop next-generation 2.xD packaging concepts and architectures.

Salary

Base: $176,000.00 - $242,000.00; Bonus/Equity: Eligible for bonus and stock award program; Benefits: Comprehensive benefits package including health and wellbeing programs

Skills & Requirements

Must-have

  • Master's or PhD in Engineering or Materials Science
  • 10 years experience with Master's or 5 with PhD
  • Expertise in 2.xD packaging technologies like FOPLP
  • Hands-on experience with lithography, etch, thin films
  • Statistical data analysis proficiency using DoE and JMP

Nice-to-have

  • Experience mentoring early-career engineers
  • Ability to present at industry conferences
  • Strong cross-functional leadership capabilities
  • Willingness to travel 10% of the time

Key Requirements

  • Master's degree with 10 years experience OR PhD with 5 years
  • Degree in Electrical Engineering, Materials Science, or Chemical Engineering
  • Proven capability to lead multi-functional teams

Work Rights

Not specified

Tailored Resume

Cover Letter