Advanced Packaging Supplier Technology Development Program Manager

Intel Corporation

Phoenix, Arizona, United States
Base: $133,800.00-255,200.00 usd; bonus/equity: st...
Supplier capacity expansion
Process tool qualification
Project management
The Advanced Packaging Substrate Integration Team seeks candidates to ensure on-time supplier capacity expansion for advanced heterogeneous packaging technology, EMIB-T

Job Summary

  • The Advanced Packaging Substrate Integration Team seeks candidates to ensure on-time supplier capacity expansion for advanced heterogeneous packaging technology, EMIB-T.
  • Responsibilities include scoping, planning, CapEx project execution through production ramp, and capability transfer to suppliers.
  • The role requires extensive work with supplier teams, internal integration teams, and process module engineering teams, with international travel expected.

Matching Summary

The Advanced Packaging Substrate Integration Team seeks candidates to ensure on-time supplier capacity expansion for advanced heterogeneous packaging technology, EMIB-T.

Salary

Base: $133,800.00-255,200.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Supplier capacity expansion
  • Process tool qualification
  • Project management
  • Technical risk assessment
  • Stakeholder management
  • Yield improvement plans

Nice-to-have

  • High tolerance for ambiguity
  • Bias for action
  • Strategic leadership capabilities
  • Supplier language skills

Key Requirements

  • PhD or Masters degree in relevant field
  • 3+ years of relevant experience (PhD) or 5+ years (Masters)
  • Demonstrated experience achieving qualification milestones
  • Experience managing cross-functional teams
  • Understanding of process building blocks
  • Knowledge of DOE, PCS, and SPC

Work Rights

Not specified

Tailored Resume

Cover Letter