Smts Process Engineer Rda /metrology

Micron Technology

Hybrid
Chip-to-wafer bonding processes
Advanced packaging experience
Technical leadership in semiconductor r&d
Micron Technology is seeking a Senior Process Engineer with expertise in chip-to-wafer and hybrid bonding processes to develop and mature high-performance 3D memory products. The role requires a strong background in semiconductor R&D, particularly in advanced packaging, and involves collaboration across multiple teams to drive technology transfer into manufacturing

Job Summary

  • Micron Technology is a world leader in innovating memory and storage solutions.
  • This role focuses on developing and scaling bonding processes for high-performance 3D memory products.
  • Micron offers a robust benefits program designed to support personal wellbeing and professional growth.

Matching Summary

Match Score: 85

Micron Technology is seeking a Senior Process Engineer with expertise in chip-to-wafer and hybrid bonding processes to develop and mature high-performance 3D memory products. The role requires a strong background in semiconductor R&D, particularly in advanced packaging, and involves collaboration across multiple teams to drive technology transfer into manufacturing.

Skills & Requirements

Must-have

  • Chip-to-wafer bonding processes
  • Advanced packaging experience
  • Technical leadership in semiconductor R&D

Nice-to-have

  • Hands-on equipment development
  • Mentoring and methodology development
  • Expertise in bonding processes

Key Requirements

  • Master’s degree or PhD in relevant field
  • 13+ years of semiconductor R&D experience
  • 10+ years in advanced packaging

Work Rights

Not specified

Tailored Resume

Cover Letter