Foundry Services Advanced Packaging Account Technical Solutions Engineer

Intel Corporation

Phoenix, Arizona, US
Base: $220,320.00-311,040.00 usd; bonus/equity: no...
On-site
Semiconductor packaging expertise
Customer relationship management
Technical consultation on packaging solutions
Intel Foundry is seeking a highly experienced and collaborative Packaging and Test Account Technical Solutions Engineer to lead customer engagements for key Packaging and Test customers

Job Summary

  • Intel Foundry is seeking a highly experienced and collaborative Packaging and Test Account Technical Solutions Engineer to lead customer engagements for key Packaging and Test customers.
  • This role is pivotal in enabling our foundry customers who are using Intel's advanced technology solutions, including our cutting-edge Advanced Packaging capabilities.
  • Responsibilities include owning the end-to-end customer relationship, providing technical consultation, coordinating internal Intel interactions, and managing the full customer engagement lifecycle.

Matching Summary

Intel Foundry is seeking a highly experienced and collaborative Packaging and Test Account Technical Solutions Engineer to lead customer engagements for key Packaging and Test customers.

Salary

Base: $220,320.00-311,040.00 USD; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • Semiconductor packaging expertise
  • Customer relationship management
  • Technical consultation on packaging solutions
  • Cross-functional team collaboration
  • Statement of Work (SOW) development

Nice-to-have

  • Voice of the Customer advocacy
  • Influence product and technology roadmaps
  • Drive commitment to execution

Key Requirements

  • 10+ years industry experience
  • 5+ years in Semiconductor Packaging, Assembly / Test or Backend Manufacturing
  • Bachelors or Masters Degree in Engineering or related field
  • Willingness to travel

Work Rights

Not specified

Tailored Resume

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