Packaging Assembly Engineer

Apple

Korea
Not specified (assumed office-based due to the nature of the role).
5+ years semiconductor packaging experience
Expertise in fcbga and 3d packaging technologies
Proficiency in materials characterization and analysis
Apple is seeking a detail-oriented IC Packaging Assembly Engineer to drive the development and optimization of advanced flip-chip BGA assembly processes. The role involves collaboration with cross-functional teams and requires significant experience in semiconductor packaging, particularly in FCBGA and advanced packaging technologies

Job Summary

  • This role involves owning the development and optimization of advanced flip-chip BGA assembly processes from pathfinding through high-volume manufacturing.
  • The successful candidate will lead SoC package development efforts while collaborating with cross-functional teams and overseas suppliers.
  • Candidates must possess extensive experience in semiconductor packaging fields including 2.5D and 3D packaging technologies.

Matching Summary

Match Score: 85

Apple is seeking a detail-oriented IC Packaging Assembly Engineer to drive the development and optimization of advanced flip-chip BGA assembly processes. The role involves collaboration with cross-functional teams and requires significant experience in semiconductor packaging, particularly in FCBGA and advanced packaging technologies.

Skills & Requirements

Must-have

  • 5+ years semiconductor packaging experience
  • Expertise in FCBGA and 3D packaging technologies
  • Proficiency in materials characterization and analysis
  • Knowledge of IC packaging reliability standards
  • Ability to work with foundry and OSAT partners

Nice-to-have

  • Experience with memory packaging solutions
  • Strong program management skills
  • Innovation in new material development
  • Excellent cross-functional communication abilities
  • Independence in project execution

Key Requirements

  • Minimum 5 years of experience in Semiconductor Packaging
  • M.S. or PhD in Materials Science, Mechanical, Chemical, or Electrical Engineering
  • Working knowledge of large FCBGA, MCM, 2.5D, and 3D packaging

Work Rights

Not specified

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