This role serves as the mechanical technical authority for airborne RF and digital processor subsystems, leading hardware development from concept through production
Job Summary
This role serves as the mechanical technical authority for airborne RF and digital processor subsystems, leading hardware development from concept through production.
Candidates must ensure subsystem performance in demanding thermal and high-vibration environments while collaborating cross-functionally with Electrical, Systems, and Manufacturing teams.
The position offers a salary range of $118,300 to $224,900 USD along with comprehensive benefits including medical, dental, vision, and 401(k) matching.
Matching Summary
This role serves as the mechanical technical authority for airborne RF and digital processor subsystems, leading hardware development from concept through production.
Salary
Base: $118,300 - $224,900 USD; Bonus/Equity: Annual short-term and/or long-term incentive programs available; Benefits: Medical, dental, vision, life insurance, 401(k) match, paid time off
Skills & Requirements
Must-have
8+ years relevant engineering experience
Design electronics packaging solutions
Apply GD&T and ASME drawing standards
Proficiency with Creo/Pro/Engineer 3D modeling
Support environmental qualification testing
Nice-to-have
Experience with Electronic Warfare or radar systems
Background in thermal and structural analysis
Knowledge of CCA/PCB integration and harness design
Experience managing cost and schedule elements
Root cause investigation skills
Key Requirements
U.S. citizenship required for security clearance
Active DoD Secret security clearance required
STEM degree with 8+ years experience or advanced degree with 5+ years