Packaging Engineering Project Manager (Experienced Packaging Technologist)(7477)

Taiwan Semiconductor Manufacturing Company Limited

California, USA
Base: $125,000 to $210,000 py; bonus/equity: not s...
Hybrid
12+ years advanced semiconductor packaging experience
Expertise in 2.5d/3d packaging technologies like cowos
Thermo-mechanical simulation and modeling skills
This role empowers customers to rapidly design next-generation products by defining competitive packaging solutions within the 3DFabric technology portfolio

Job Summary

  • This role empowers customers to rapidly design next-generation products by defining competitive packaging solutions within the 3DFabric technology portfolio.
  • The successful candidate will manage customer projects for advanced 2.5D/3D packaging, guiding them from conceptualization through production qualification for AI/HPC applications.
  • TSMC offers a comprehensive compensation package including market-competitive pay, allowances, bonuses, and extensive development opportunities.

Matching Summary

This role empowers customers to rapidly design next-generation products by defining competitive packaging solutions within the 3DFabric technology portfolio.

Salary

Base: $125,000 to $210,000 per year; Bonus/Equity: Not specified; Benefits: Allowances, bonuses, and comprehensive benefits included

Skills & Requirements

Must-have

  • 12+ years advanced semiconductor packaging experience
  • Expertise in 2.5D/3D packaging technologies like CoWoS
  • Thermo-mechanical simulation and modeling skills
  • Customer engagement and technical solution ownership
  • Cross-functional team leadership for complex projects

Nice-to-have

  • Ph.D. in Materials Science or related field
  • Experience with photonic packaging and CPO
  • Portfolio of patents in advanced packaging
  • Strong program and project management skills
  • Self-motivated desire to learn and engage

Key Requirements

  • Master's degree in Mechanical, Electrical, or Materials Engineering
  • 12+ years of industry experience in advanced packaging
  • Proven expertise in heterogeneous integration and bonding technologies

Work Rights

Not specified

Tailored Resume

Cover Letter