Semi Packaging Engineer

Analog Devices

MA, United States
Ic packaging design and qualification
Mechanical stress and thermal simulations
Prototype assembly and qualification
This position is an opportunity for a new college graduate to work on conceptualizing and productizing semiconductor-based electronic devices

Job Summary

  • This position is an opportunity for a new college graduate to work on conceptualizing and productizing semiconductor-based electronic devices.
  • You will be part of a global manufacturing organization that is functionalizing sensing of our physical world and converting them to digital signals for intelligent processing.
  • As an engineer, you are expected to work with cross-functional teams to develop advanced IC packaging solutions that include design, material selections, qualification, and release-to-manufacturing for various product groups.

Matching Summary

This position is an opportunity for a new college graduate to work on conceptualizing and productizing semiconductor-based electronic devices.

Skills & Requirements

Must-have

  • IC packaging design and qualification
  • Mechanical stress and thermal simulations
  • Prototype assembly and qualification
  • Manufacturing process flows documentation
  • Reliability criteria establishment

Nice-to-have

  • Cross-functional team communication
  • Global team collaboration
  • Problem-solving skillset
  • Learning mindset

Key Requirements

  • Master's degree in Engineering
  • Fundamentals of materials and mechanical behavior
  • 3D CAD tools (e.g. SolidWorks)
  • FEA software ANSYS
  • Up to 1-year post-master's experience

Work Rights

Not specified

Tailored Resume

Cover Letter