Sr Director Analyst- Semiconductor Foundry And Advanced Packaging Technology/markets

Gartner

Base: 172,000 usd - 202,500 usd; bonus/equity: ann...
Hybrid
12-18 years in foundry or osat ecosystem
Deep understanding of tsmc samsung intel operations
Expertise in cowos 2.5d 3d advanced packaging
Gartner is seeking a Senior Director Analyst specializing in Semiconductor Foundry and Advanced Packaging Technology/Markets, responsible for delivering insights to clients in the semiconductor industry. The ideal candidate will have extensive experience in foundry operations and advanced packaging, along with strong analytical and presentation skills

Job Summary

  • This role requires owning the global semiconductor foundry capacity narrative for AI infrastructure and translating wafer capacity into deployable compute supply.
  • The position involves building point-of-view on AI-driven foundry capacity formation, node transitions, and advanced packaging constraints like CoWoS.
  • Gartner offers a hybrid work environment with world-class benefits including a 401k match up to $7,200 per year and uncapped sales incentive plans.

Matching Summary

Match Score: 85

Gartner is seeking a Senior Director Analyst specializing in Semiconductor Foundry and Advanced Packaging Technology/Markets, responsible for delivering insights to clients in the semiconductor industry. The ideal candidate will have extensive experience in foundry operations and advanced packaging, along with strong analytical and presentation skills.

Salary

Base: 172,000 USD - 202,500 USD; Bonus/Equity: Annual bonus plan or uncapped sales incentive plan; Benefits: Generous PTO, 401k match up to $7,200, company stock discount

Skills & Requirements

Must-have

  • 12-18 years in foundry or OSAT ecosystem
  • Deep understanding of TSMC Samsung Intel operations
  • Expertise in CoWoS 2.5D 3D advanced packaging
  • Ability to translate technical signals into market insights
  • Experience with wafer starts yield ramp and fab economics

Nice-to-have

  • Exposure to HBM integration and chiplet technologies
  • Financial modeling or investor-facing experience
  • Prior experience speaking at industry events
  • Experience interacting with hyperscaler customers

Key Requirements

  • 12-18+ years of relevant industry experience
  • Deep expertise in substrate materials and test flows
  • Strong grasp of utilization and ramp curves

Work Rights

Not specified

Tailored Resume

Cover Letter