Technical interface with vendors and assembly houses
The role involves leading the full design flow of organic and ceramic multi-layer microelectronics packaging from customer needs to final validation
Job Summary
The role involves leading the full design flow of organic and ceramic multi-layer microelectronics packaging from customer needs to final validation.
Candidates will act as the key technical interface with packaging vendors and assembly houses while conducting necessary electrical, thermal, and mechanical simulations.
Teledyne e2v offers a structured onboarding program with a dedicated mentor and opportunities for international exposure within the Teledyne group.
Matching Summary
The role involves leading the full design flow of organic and ceramic multi-layer microelectronics packaging from customer needs to final validation.
Skills & Requirements
Must-have
Microelectronics packaging design experience
Package layout with Cadence APD or equivalent
Technical interface with vendors and assembly houses
Electrical, thermal, and mechanical simulations
DRC checks and design review leadership
Nice-to-have
Experience in imaging and assembly sectors
Knowledge of electrical modelisation and parasitic extraction
Thermal simulation skills using Ansys Workbench
System and sub-system development background
Spanish language proficiency
Key Requirements
Master's degree in microelectronics, electronics, material science, or micromechanics