$70,000 + ; not specified; competitive health bene...
On-site
Microelectronics research
Advanced packaging
Integrated circuit design
The Texas Institute for Electronics (TIE) is a semiconductor consortium focused on developing and executing a 3D Heterogenous Integration manufacturing technology roadmap
Job Summary
The Texas Institute for Electronics (TIE) is a semiconductor consortium focused on developing and executing a 3D Heterogenous Integration manufacturing technology roadmap.
The Postdoctoral Fellowship position aims to advance research in microelectronics, advanced packaging, and design enablement, developing early-career researchers through applied and fundamental research.
UT Austin provides outstanding employee benefits including competitive health benefits, generous paid time off, and a defined benefit retirement plan with employer matching funds.
Matching Summary
The Texas Institute for Electronics (TIE) is a semiconductor consortium focused on developing and executing a 3D Heterogenous Integration manufacturing technology roadmap.
Salary
$70,000+; Not specified; Competitive health benefits, generous paid vacation, sick time, and holidays, Teachers Retirement System of Texas
Skills & Requirements
Must-have
Microelectronics research
Advanced packaging
Integrated circuit design
Electronic design automation (EDA)
Cross-stack optimizations
Nice-to-have
Multi-physics simulations
Applied machine learning
Modeling and optimization
Key Requirements
PhD in Electrical and/or Computer Engineering within last 3 years
Focus on integrated circuit design, packaging, and EDA
Familiarity with commercial EDA tools (Cadence, Synopsys/Ansys, Siemens)