This position supports the Semiconductor Equipment Division by providing process engineering for advanced Reactive Ion Etch (RIE) equipment used in 2nm and beyond nodes
Job Summary
This position supports the Semiconductor Equipment Division by providing process engineering for advanced Reactive Ion Etch (RIE) equipment used in 2nm and beyond nodes.
Candidates will join either a Demo Team focused on winning tool-of-record selections or a Productivity Team supporting high-volume manufacturing ramp and troubleshooting.
The role requires hands-on development, data analysis, and reporting to meet customer specifications while maintaining strict safety and intellectual property protocols.
Matching Summary
This position supports the Semiconductor Equipment Division by providing process engineering for advanced Reactive Ion Etch (RIE) equipment used in 2nm and beyond nodes.
Salary
Base: $64,811.80 - $146,963.71 annually; Bonus/Equity: Eligible for incentive pay and allowances; Benefits: Not specified
Skills & Requirements
Must-have
BS or MS degree in Chemical Engineering
Hands-on process engineering development
Understanding of plasma science and RIE
Experience with Statistical Process Control SPC
Design of Experiments DOE proficiency
Cleanroom environment work capability
Nice-to-have
Prior semiconductor equipment experience
Plasma etch process development background
Familiarity with metrology methods
Ability to lead cross-team projects
Willingness to travel internationally
Strong collaboration in matrix environment
Key Requirements
BS/MS/PhD in Chemical Engineering, Materials Science, Physics, or related field
PE IV: PhD with 3+ years or MS with 6+ years or BS with 8+ years experience
Minimum travel requirement under 5% with possible trips to Japan
US work authorization required (implied by location and company)