Silicon Packaging Design Engineer

Altera

Penang, Malaysia
Package design solution development
Package signal and integrity requirement
Substrate physical design reviews
Develop next generation package solution from concept till tape-out, ensuring requirements for quality, performance, and cost are met

Job Summary

  • Develop next generation package solution from concept till tape-out, ensuring requirements for quality, performance, and cost are met.
  • Manage multiple designs concurrently, working with multi-disciplinary teams and leading package design efforts for pin map/ball map development.
  • Perform package design work per business process from layout till documentation, managing and closing design-related issues.

Matching Summary

Develop next generation package solution from concept till tape-out, ensuring requirements for quality, performance, and cost are met.

Skills & Requirements

Must-have

  • package design solution development
  • package signal and integrity requirement
  • substrate physical design reviews
  • design validation tools
  • package substrate manufacturing vendors
  • package design business process

Nice-to-have

  • team player
  • highly motivated
  • self-directed
  • continuous improvement
  • industry-leading designs

Key Requirements

  • BSEE/MS in Electrical/Electronic Engineering
  • Familiarity in Design tool experience
  • Knowledge of signal integrity and power integrity basics
  • Good verbal and written skills

Work Rights

Not specified

Tailored Resume

Cover Letter