Semiconductor Packaging Engineering Phd Intern

Intel

Phoenix, Arizona, United States
Base: $99,700.00-134,800.00 usd annual range; bonu...
Phd in mechanical or materials science
Molecular dynamics modeling experience
Ai/ml techniques for engineering applications
Join Intel as a Manufacturing Engineering Graduate Intern to optimize engineering processes and enhance factory operations in semiconductor manufacturing

Job Summary

  • Join Intel as a Manufacturing Engineering Graduate Intern to optimize engineering processes and enhance factory operations in semiconductor manufacturing.
  • The role involves developing and validating finite element analysis models to simulate thermal and mechanical behavior of semiconductor packages.
  • Intel offers a total rewards package including competitive pay, stock bonuses, and comprehensive health and retirement benefits.

Matching Summary

Join Intel as a Manufacturing Engineering Graduate Intern to optimize engineering processes and enhance factory operations in semiconductor manufacturing.

Salary

Base: $99,700.00-134,800.00 USD annual range; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, vacation programs

Skills & Requirements

Must-have

  • PhD in Mechanical or Materials Science
  • Molecular Dynamics modeling experience
  • AI/ML techniques for engineering applications
  • FEA simulation of semiconductor packages
  • CFD/FEM software proficiency like Ansys

Nice-to-have

  • Design of Experiments (DOE) principles
  • Strong communication and collaboration skills
  • Experience with parallel computation software

Key Requirements

  • Pursuing PhD in Mechanical, Chemical, or Materials Science
  • 4+ years experience with AI/ML in engineering
  • 4+ years research in Molecular Dynamics
  • 4+ years experience with LAMMPS, Gromacs, NAMD, or OpenMM
  • 4+ years experience with CFD/FEM software

Work Rights

Not specified

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