Smts Photonics Advanced Packaging Integration

GlobalFoundries

$107,400.00 - $204,500.00 py
Hybrid
Silicon photonics packaging
Fiber-to-chip coupling strategies
2.5d/3d/3.5d packaging technologies
Lead the development and sustainment of advanced optical packaging solutions for silicon photonics and co-packaged optics platforms

Job Summary

  • Lead the development and sustainment of advanced optical packaging solutions for silicon photonics and co-packaged optics platforms.
  • Collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures.
  • Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.

Matching Summary

Lead the development and sustainment of advanced optical packaging solutions for silicon photonics and co-packaged optics platforms.

Salary

$107,400.00 - $204,500.00

Skills & Requirements

Must-have

  • Silicon Photonics packaging
  • Fiber-to-chip coupling strategies
  • 2.5D/3D/3.5D packaging technologies
  • Multiphysics simulations
  • Yield and reliability issue analysis
  • Mass production readiness
  • Cost modeling and reduction

Nice-to-have

  • Automated optical test setups
  • Co-packaged optics (CPO) knowledge
  • Thermal/mechanical modeling expertise
  • Cross-functional team leadership

Key Requirements

  • Master's degree or higher
  • 5+ years semiconductor packaging experience
  • Hands-on fiber attach experience
  • Familiarity with packaging technologies
  • Understanding of reliability standards
  • Experience bringing products to production
  • Strong English communication skills

Work Rights

Not specified

Tailored Resume

Cover Letter