2026 Intern - Packaging Engineer

NXP Semiconductors

Tianjin, China
Ic packaging technology
New packaging technology development
Advanced material interface study
This position is a packaging front-end R&D intern, and will be focusing on IC (integrated circuit) packaging technology research and development

Job Summary

  • This position is a packaging front-end R&D intern, and will be focusing on IC (integrated circuit) packaging technology research and development.
  • Work with global team to finish development projects and other tasks including new packaging technology development, new package related process development, advanced material interface study, and advanced IC package failure analysis.
  • Coordinate/lead development project independently and communicate/cooperate among global teams (US/ Europe /Malaysia/Japan/France/etc.).

Matching Summary

This position is a packaging front-end R&D intern, and will be focusing on IC (integrated circuit) packaging technology research and development.

Skills & Requirements

Must-have

  • IC packaging technology
  • New packaging technology development
  • Advanced material interface study
  • Advanced IC package failure analysis
  • Development project coordination

Nice-to-have

  • Global team cooperation
  • Independent project leadership

Key Requirements

  • Pursuing bachelor or master degree
  • Major on Metallic Materials Engineering
  • Major on Polymer Materials Engineering
  • Major on Mechanical Engineering and Automation
  • Good oral and written English

Work Rights

Not specified

Tailored Resume

Cover Letter