Advanced Packaging Module Development Engineer

Intel

Phoenix, Arizona, United States
$133,800.00-188,890.00 usd; not specified; not spe...
Hybrid
Process development and optimization
Equipment development and capability
Statistical methodologies and doe
Drive innovation and shape the future of advanced IC packaging solutions by optimizing processes and equipment

Job Summary

  • Drive innovation and shape the future of advanced IC packaging solutions by optimizing processes and equipment.
  • Apply a strong understanding of process characterization, equipment capability, and statistical methodologies to enable manufacturability.
  • Contribute to Intel’s mission to deliver innovative, reliable, and manufacturable packaging solutions that power the next generation of semiconductor technology.

Matching Summary

Drive innovation and shape the future of advanced IC packaging solutions by optimizing processes and equipment.

Salary

$133,800.00-188,890.00 USD; Not specified; Not specified

Skills & Requirements

Must-have

  • Process development and optimization
  • Equipment development and capability
  • Statistical methodologies and DoE
  • Process characterization and control
  • Materials testing and characterization

Nice-to-have

  • Data-driven problem solving
  • Cross-functional collaboration
  • Continuous learning and improvement
  • Adaptable to fast-paced environments

Key Requirements

  • Bachelor's degree in relevant field
  • 4+ years of experience
  • Experience with process development
  • Experience with DoE and statistical analysis
  • Experience with process characterization
  • Experience with materials testing

Work Rights

Not specified

Tailored Resume

Cover Letter