(senior) Member Of Technical Staff / Director, Process Engineering, Advanced Packaging
ASM International
Phoenix, Arizona, US
On-site
Ph.d. in materials science or related field
10-15 years semiconductor process experience
Expertise in ald, peald, cvd, pecvd technologies
This role involves leading a team of experts to drive the development of high-thermal-conductivity thin films for next-generation computing and advanced packaging
Job Summary
This role involves leading a team of experts to drive the development of high-thermal-conductivity thin films for next-generation computing and advanced packaging.
The successful candidate will leverage ASM's expertise in ALD, PEALD, CVD, and PECVD to design and qualify materials that meet demanding customer requirements.
ASM values diversity, inclusion, and sustainability while offering development programs to support employee growth and innovation.
Matching Summary
This role involves leading a team of experts to drive the development of high-thermal-conductivity thin films for next-generation computing and advanced packaging.
Skills & Requirements
Must-have
Ph.D. in Materials Science or related field
10-15 years semiconductor process experience
Expertise in ALD, PEALD, CVD, PECVD technologies
Developing high-thermal-conductivity materials
Leading senior-level technical teams
Nice-to-have
Generating patents or technical publications
Building high-performance collaborative cultures
Influencing product direction through innovation
Strong reputation as a thought leader
Experience with heterogenous integration strategies