Semiconductor Packaging Engineering Intern - Summer 2026

NXP Semiconductors

Austin, US
Packaging solutions implementation
Package definition and validation
Mechanical analysis of packages
The Packaging Innovation organization is responsible for the implementation of packaging solutions for new product introduction and new technology development

Job Summary

  • The Packaging Innovation organization is responsible for the implementation of packaging solutions for new product introduction and new technology development.
  • Interns will work with packaging engineers to help define and validate packages used for new products for NXP.
  • Potential work involves lab testing, mechanical analysis, CAD design, and modeling of package performance.

Matching Summary

The Packaging Innovation organization is responsible for the implementation of packaging solutions for new product introduction and new technology development.

Skills & Requirements

Must-have

  • packaging solutions implementation
  • package definition and validation
  • mechanical analysis of packages
  • CAD for package design
  • package performance modeling

Nice-to-have

  • team player with positive attitude
  • self-driven with good communication
  • willingness to learn new concepts
  • apply fundamental knowledge to problems

Key Requirements

  • B.S, M.S. or Ph.D. Candidate
  • Materials Science, Mechanical or Electrical Engineering
  • Returning to school post-internship
  • Working knowledge of MS Office tools

Work Rights

Not specified

Tailored Resume

Cover Letter