$120,860.00-231,670.00 usd; not specified; not spe...
Hybrid
Equipment and process optimization
300mm toolsets
Thick metal/via layers
The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly
Job Summary
The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly.
You will be responsible for owning all aspects of one or more of our factory's 300mm toolsets in the segment responsible for thick metal/via layers, bumping, reflow, thinning, and backside metallization.
We offer competitive salary and financial benefits as well as programs that promote health and well-being.
Matching Summary
The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly.
Salary
$120,860.00-231,670.00 USD; Not specified; Not specified
Skills & Requirements
Must-have
Equipment and process optimization
300mm toolsets
Thick metal/via layers
Bumping, reflow, thinning, backside metallization
Sustaining responsibilities
Excursion prevention and response
Continuous improvement
Nice-to-have
High-performing culture
Execution with urgency
Data-driven problem solving
Thrive in dynamic environments
Teamwork and leadership skills
Excellent communication skills
Key Requirements
Bachelor's Degree in STEM
6+ years semiconductor Engineering experience
Advanced degree or 10+ years semiconductor experience