Base: $113,600.00-$151,400.00; bonus/equity: not s...
Automated wire bonding process expertise
Process optimization and doe leadership
Statistical process control and analysis
The engineer is responsible for developing and sustaining automated wire bonding processes to ensure process capability, repeatability, and compliance with quality and reliability requirements
Job Summary
The engineer is responsible for developing and sustaining automated wire bonding processes to ensure process capability, repeatability, and compliance with quality and reliability requirements.
This role involves providing hands-on support to operators and technicians while collaborating cross-functionally with Design, Quality, Manufacturing Engineering, and Supply Chain teams.
Teledyne Technologies is committed to high ethical standards and equal opportunity employment, fostering an environment where employees can make an impact and be part of a winning team.
Matching Summary
The engineer is responsible for developing and sustaining automated wire bonding processes to ensure process capability, repeatability, and compliance with quality and reliability requirements.
Salary
Base: $113,600.00-$151,400.00; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
Automated wire bonding process expertise
Process optimization and DOE leadership
Statistical process control and analysis
Equipment troubleshooting and maintenance
Cross-functional collaboration
Process documentation and compliance
Nice-to-have
Experience in aerospace or defense manufacturing
Familiarity with MIL-STD-883 and NASA standards
Knowledge of microelectronic assembly processes
MES systems and digital documentation
Strong communication and training skills
Continuous improvement mindset
Key Requirements
Bachelor’s degree in engineering or related field preferred
3+ years experience in microelectronics manufacturing
US Citizen or PERM Resident required
Proficiency with SPC, DOE, and statistical analysis
Ability to troubleshoot equipment and process issues
Experience with MIL-STD-883 and high-reliability bonding