Digital Hw Design

GE HealthCare

Beijing, China
On-site
Schematic design
High-speed digital circuit design
Ddr, pcie, usb, ethernet interfaces
GE HealthCare is seeking talented engineering students graduating in 2027 for an internship in their Beijing R&D team. This opportunity involves real project involvement, exposure to cutting-edge technologies, and mentorship from technical experts

Job Summary

  • Interns will participate in real R&D projects, engage with cutting-edge technologies, and enhance engineering practical skills.
  • Receive one-on-one guidance from technical experts and have face-to-face communication with executives.
  • Excellent performers may have the opportunity for full-time conversion to the EEDP program.

Matching Summary

Match Score: 85

GE HealthCare is seeking talented engineering students graduating in 2027 for an internship in their Beijing R&D team. This opportunity involves real project involvement, exposure to cutting-edge technologies, and mentorship from technical experts.

Skills & Requirements

Must-have

  • Schematic design
  • High-speed digital circuit design
  • DDR, PCIe, USB, Ethernet interfaces
  • Signal Integrity (SI) and Power Integrity (PI) analysis
  • Board bring-up and debugging
  • FPGA development experience

Nice-to-have

  • International team work atmosphere
  • Exploration spirit and strong learning ability
  • Self-driven and optimistic attitude
  • Project experience
  • Long-term internship availability

Key Requirements

  • Master's degree in engineering (graduating before July 2027)
  • Minimum 8 weeks internship, 4 days per week
  • Excellent academic performance and solid foundation
  • Strong communication and expression skills
  • Good English written and spoken skills

Work Rights

Not specified

Tailored Resume

Cover Letter