Intern - Assembly Equipment Engineer

Micron Technology

Not specified
Electrical engineering skills
Manufacturing engineering knowledge
Collaboration with engineering teams
Micron Technology is seeking an Intern - Assembly Equipment Engineer to improve the detection and alarm capabilities for Non-Stick On Pad (NSOP) failures in their Wire Bond process. The role involves collaboration with multiple engineering teams to enhance operational efficiency and minimize downtime

Job Summary

  • Micron Technology is a leader in memory and storage solutions.
  • The role focuses on improving alarm capabilities for early detection of bond stick failures.
  • Collaboration with various engineering teams is essential for success.

Matching Summary

Match Score: 75

Micron Technology is seeking an Intern - Assembly Equipment Engineer to improve the detection and alarm capabilities for Non-Stick On Pad (NSOP) failures in their Wire Bond process. The role involves collaboration with multiple engineering teams to enhance operational efficiency and minimize downtime.

Skills & Requirements

Must-have

  • Electrical Engineering skills
  • Manufacturing Engineering knowledge
  • Collaboration with engineering teams

Nice-to-have

  • Experience with alarm systems
  • Data analysis skills
  • Problem-solving abilities

Key Requirements

  • Electrical / Equipment Engineering background
  • Experience in Semiconductor / Mechanical / Mechatronics Engineering

Work Rights

Not specified

Tailored Resume

Cover Letter