Package Health - Senior Manager/Manager, Advanced Packaging Technology Development

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Singapore, Singapore
Not specified; not specified; not specified
Not specified
Package health monitoring and diagnostics
Dft methodologies and test coverage strategies
Mechanical thermal electrical simulation studies
Micron Semiconductor Asia Operations Pte. Ltd. is seeking a Senior Manager/Manager for their Package Health team in Singapore. The successful candidate will lead a team focused on developing solutions for package health monitoring and will require extensive experience in semiconductor packaging and engineering management

Job Summary

  • This role leads a team of engineers focused on developing scalable solutions for package health monitoring and characterization.
  • The position requires driving the implementation of DFT methodologies and managing complex simulation studies for mechanical stress and thermal behavior.
  • Candidates must collaborate with IT and data science teams to deploy analytics models while supporting qualification testing for new packaging technologies.

Matching Summary

Match Score: 85

Micron Semiconductor Asia Operations Pte. Ltd. is seeking a Senior Manager/Manager for their Package Health team in Singapore. The successful candidate will lead a team focused on developing solutions for package health monitoring and will require extensive experience in semiconductor packaging and engineering management.

Salary

Not specified; Not specified; Not specified

Skills & Requirements

Must-have

  • Package health monitoring and diagnostics
  • DFT methodologies and test coverage strategies
  • Mechanical thermal electrical simulation studies
  • Failure detection and prevention solutions
  • Qualification and reliability testing support

Nice-to-have

  • AI ML applications in manufacturing reliability
  • Advanced analytics dashboards and models
  • Strong stakeholder management communication skills
  • Proven problem solving and multitasking abilities

Key Requirements

  • Master's or Bachelor's degree in Electrical Engineering or Materials Science
  • 7+ years experience in semiconductor packaging test or reliability engineering
  • Experience defining test architectures and managing probe yield
  • Knowledge of DRAM or ASIC product testing and fail modes

Work Rights

Not specified

Tailored Resume

Cover Letter