Si/pi For 3dic Sr Principle Solutions Engineer

Cadence

United States
Base: $143,500 to $266,500 (california); bonus/equ...
Fully remote
15+ years signal integrity power integrity experience
Expert knowledge of cadence sigrity clarity tools
Advanced packaging 2.5d 3dic stacked die technologies
This position involves defining and leading the development of advanced packaging and 3DIC analysis flows for foundry and customer solutions

Job Summary

  • This position involves defining and leading the development of advanced packaging and 3DIC analysis flows for foundry and customer solutions.
  • The candidate must have expert knowledge of the Cadence toolset or equivalent competitor toolsets in the context of multiple flows including high-speed signal design and power design.
  • Benefits include paid vacation, a 401(k) plan with employer match, employee stock purchase plan, and a variety of medical, dental, and vision plan options.

Matching Summary

This position involves defining and leading the development of advanced packaging and 3DIC analysis flows for foundry and customer solutions.

Salary

Base: $143,500 to $266,500 (California); Bonus/Equity: Eligible for incentive compensation; Benefits: Paid vacation, 401(k) match, medical/dental/vision

Skills & Requirements

Must-have

  • 15+ years Signal Integrity Power Integrity experience
  • Expert knowledge of Cadence Sigrity Clarity tools
  • Advanced packaging 2.5D 3DIC stacked die technologies
  • High-speed high-performance signal and power integrity issues

Nice-to-have

  • Strong personal drive for continuous learning
  • Excellent verbal and written communication skills
  • Understanding of chip level CMOS design concepts

Key Requirements

  • Bachelor's degree (Masters preferred) in Electrical or Electronics Engineering
  • Minimum 15 years experience with SI/PI/Thermal/RF related to Package and PCB Design
  • 5+ years experience with Cadence Allegro platform tools
  • Must be located in the US

Work Rights

Not specified

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