Base: $25 to $31 ph; bonus: discretionary performa...
Onsite
Manual and automated wedge and ball bonding experience
Ability to work 8 hours under microscope with fine tools
Experience with rf/dc gold wire and ribbon bonding
Analog Devices, Inc. is seeking a Wirebond Operator in Chelmsford, MA, to support the production of high-performance microwave modules. The ideal candidate will have experience in RF/DC gold wire bonding, attention to detail, and the ability to work with delicate components in a high-tech manufacturing environment
Job Summary
Analog Devices is a global semiconductor leader seeking an energetic team player to manufacture high-performance microwave modules.
The role requires hands-on operation of manual, semi-manual, and automatic bonding equipment while utilizing miniaturized hand tools under a microscope.
This position offers medical, vision, dental coverage, 401k, paid vacation, holidays, sick time, and a discretionary performance-based bonus.
Matching Summary
Match Score: 85
Analog Devices, Inc. is seeking a Wirebond Operator in Chelmsford, MA, to support the production of high-performance microwave modules. The ideal candidate will have experience in RF/DC gold wire bonding, attention to detail, and the ability to work with delicate components in a high-tech manufacturing environment.
Salary
Base: $25 to $31 per hour; Bonus: Discretionary performance-based bonus available; Benefits: Medical, vision, dental, 401k, paid vacation, holidays, and sick time
Skills & Requirements
Must-have
Manual and automated wedge and ball bonding experience
Ability to work 8 hours under microscope with fine tools
Experience with RF/DC gold wire and ribbon bonding
Proficiency with Dage testers for bond pull/shear testing
Knowledge of plasma and solvent cleaning technologies
Nice-to-have
Vocational High School or Technical Diploma
Willingness to be cross-trained for related duties
Strong computer skills for retrieving drawings
Key Requirements
US Citizenship required for security clearance
High school diploma or GED required
2-3 years of RF/DC gold wire and ribbon bonding experience
Familiarity with microelectronics assembly processes