2026 Intern - Packaging Engineer

NXP USA INC.

Tianjin, China
Ic packaging technology research
New packaging technology development
Good communication in english
This position is a packaging front-end R&D intern focusing on IC packaging technology research and development

Job Summary

  • This position is a packaging front-end R&D intern focusing on IC packaging technology research and development.
  • The intern will work with a global team to finish development projects and other tasks.
  • Responsibilities include new packaging technology development and advanced IC package failure analysis.

Matching Summary

This position is a packaging front-end R&D intern focusing on IC packaging technology research and development.

Skills & Requirements

Must-have

  • IC packaging technology research
  • New packaging technology development
  • Good communication in English

Nice-to-have

  • Global team collaboration
  • Advanced material interface study

Key Requirements

  • Pursuing bachelor or master degree
  • Major in Metallic Materials Engineering
  • Good communication skills

Work Rights

Not specified

Tailored Resume

Cover Letter