Signal Integrity Engineer (Package Substrate)

ETHOS SEARCH ASSOCIATES PTE. LTD.

Singapore
Signal integrity in package substrate
Vna and tdr measurement tools
S-parameter processing and impedance analysis
The role is responsible for Signal Integrity across package substrates, cables, sockets, connectors, and PCBs

Job Summary

  • The role is responsible for Signal Integrity across package substrates, cables, sockets, connectors, and PCBs.
  • Candidates must perform analog and impedance characterization using VNA, TDR, and high-speed oscilloscopes.
  • The position requires a Master or Bachelor degree in Electrical or Microwave Engineering with experience in S-parameter processing.

Matching Summary

Match Score: 85

The role is responsible for Signal Integrity across package substrates, cables, sockets, connectors, and PCBs.

Skills & Requirements

Must-have

  • Signal Integrity in package substrate
  • VNA and TDR measurement tools
  • S-parameter processing and impedance analysis
  • High-speed digital interfaces PCIe DDR
  • Electrical modeling EDA tools HFSS SI wave ADS

Nice-to-have

  • Cross-functional collaboration across multiple sites
  • Self-driven problem-solving approach
  • Design of test boards and fixtures

Key Requirements

  • Master/Bachelor degree in Electrical or Microwave Engineering
  • Exposure to Signal Integrity characterization using VNA and TDR
  • Background in S-parameter processing and impedance analysis

Work Rights

Not specified

Tailored Resume

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