Semiconductor Packaging Engineering Phd Intern

Intel

Phoenix, Arizona, United States
Base: $72,900.00-134,800.00 usd; bonus/equity: not...
Computational fluid dynamics
Two phase flows
Semiconductor packaging
Contributes to the design and optimization of manufacturing engineering processes and factory operation

Job Summary

  • Contributes to the design and optimization of manufacturing engineering processes and factory operation.
  • Develop and validate computational fluid dynamics (CFD) models to simulate specific assembly processes of advanced semiconductor packages.
  • Our total rewards package goes above and beyond just a paycheck.

Matching Summary

Contributes to the design and optimization of manufacturing engineering processes and factory operation.

Salary

Base: $72,900.00-134,800.00 USD; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • computational fluid dynamics
  • two phase flows
  • semiconductor packaging
  • manufacturing engineering processes

Nice-to-have

  • AI/ML
  • collaborative environment
  • practical engineering problems

Key Requirements

  • Pursuing PhD degree
  • Mechanical Engineering, Chemical Engineering or Material Sciences
  • related field with focus on computatinal fluid dynamics
  • two phase flows

Work Rights

Not specified

Tailored Resume

Cover Letter