Advanced Packaging Yield Analysis And Defect Engineer

Intel Corporation

Phoenix, Arizona, United States
Base: $141,910.00-269,100.00 usd; bonus/equity: st...
Us citizenship required
5+ years data analysis experience
Jmp python statistical software
The role focuses on driving yield and defect improvement across the Advanced Packaging Technology portfolio through data synthesis and statistical analysis

Job Summary

  • The role focuses on driving yield and defect improvement across the Advanced Packaging Technology portfolio through data synthesis and statistical analysis.
  • Candidates must possess deep knowledge of inline metrology, DFT, sort/test integration, and the ability to influence the yield roadmap.
  • Intel offers a competitive compensation package including stock bonuses and comprehensive health benefits for this high-performing team culture.

Matching Summary

The role focuses on driving yield and defect improvement across the Advanced Packaging Technology portfolio through data synthesis and statistical analysis.

Salary

Base: $141,910.00-269,100.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, vacation

Skills & Requirements

Must-have

  • US Citizenship Required
  • 5+ years data analysis experience
  • JMP Python statistical software
  • Inline defect metrology knowledge
  • Electrical and physical fail analysis

Nice-to-have

  • Active US Government clearance
  • Leadership of small engineering teams
  • Cross-functional partnership skills
  • Machine learning techniques application
  • Flexible to adapt to new methods

Key Requirements

  • Bachelor's degree with 6+ years experience OR Master's with 4+ years OR PhD with 2+ years
  • Required: US Citizenship and ability to maintain active government clearance
  • 5+ years experience in data analysis using JMP, Python, or similar tools

Work Rights

Must have US citizenship

Tailored Resume

Cover Letter