Advanced Packaging Yield Analysis And Defect Engineer

Intel Retiree Medical Plan Trust

Phoenix, Arizona, United States
Base: $141,910.00-269,100.00 usd; bonus/equity: no...
On-site
Data analysis with jmp or python
Statistical methods and machine learning
Understanding of electrical and physical fails
Drive yield and defect improvement across APTM portfolio of packaging technologies

Job Summary

  • Drive yield and defect improvement across APTM portfolio of packaging technologies.
  • Extract insights from structured and unstructured data by quickly synthesizing large volumes of data, applying statistical methods and machine learning techniques.
  • Develop solutions to problems by utilizing formal education, knowledge of manufacturing process, statistical knowledge, and problem-solving tools.

Matching Summary

Drive yield and defect improvement across APTM portfolio of packaging technologies.

Salary

Base: $141,910.00-269,100.00 USD; Bonus/Equity: Not specified; Benefits: Competitive pay, stock bonuses, and benefit programs

Skills & Requirements

Must-have

  • Data analysis with JMP or Python
  • Statistical methods and machine learning
  • Understanding of electrical and physical fails
  • Inline defect metrology knowledge
  • Cross-functional partnership development

Nice-to-have

  • High-performing team culture
  • Tolerance of ambiguity
  • Positive can-do attitude

Key Requirements

  • 6+ years of experience with Bachelor's degree
  • 4+ years of experience with Master's degree
  • 2+ years of experience with PhD degree
  • 5+ years of experience in data analysis
  • US Citizenship Required

Work Rights

Must have US citizenship

Tailored Resume

Cover Letter