Packaging Module Process Development Engineer

Intel Corporation

Phoenix, Arizona, United States
Base: $133,800.00-188,890.00 usd; bonus/equity: st...
Statistical process controls (spc)
Fmea and doe experience
Semiconductor fabrication experience
This role is responsible for advancing packaging process development through the application of novel concepts to enable future assembly packaging platform technologies

Job Summary

  • This role is responsible for advancing packaging process development through the application of novel concepts to enable future assembly packaging platform technologies.
  • The candidate will optimize manufacturing efficiency by developing processes that meet strict quality, reliability, cost, yield, and productivity requirements.
  • Intel Foundry offers a competitive compensation package including stock bonuses and comprehensive benefit programs for employees in this on-site role.

Matching Summary

This role is responsible for advancing packaging process development through the application of novel concepts to enable future assembly packaging platform technologies.

Salary

Base: $133,800.00-188,890.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • Statistical Process Controls (SPC)
  • FMEA and DOE experience
  • Semiconductor fabrication experience

Nice-to-have

  • Dispense and material development
  • Product ownership and change control
  • Project management skills

Key Requirements

  • Bachelor's degree with 6+ years experience OR Master's with 4+ years OR PhD with 2+ years
  • Engineering, Physics, or Chemistry degree required
  • On-site presence required in Phoenix, Arizona

Work Rights

Not specified

Tailored Resume

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