NXP USA Inc. is seeking a 2026 Intern in Packaging Engineering based in Tianjin, China. The role focuses on integrated circuit packaging technology research and development, requiring candidates to collaborate with global teams on various technical projects
Job Summary
This position is a packaging front-end R&D intern, focusing on IC (integrated circuit) packaging technology research and development.
You will work with a global team to finish development projects and other tasks.
Responsibilities include new packaging technology development, process development, material interface study, and failure analysis.
Matching Summary
Match Score: 85
NXP USA Inc. is seeking a 2026 Intern in Packaging Engineering based in Tianjin, China. The role focuses on integrated circuit packaging technology research and development, requiring candidates to collaborate with global teams on various technical projects.
Skills & Requirements
Must-have
IC packaging technology research
New packaging technology development
New package related process development
Advanced material interface study
Advanced IC package failure analysis
Global team communication and cooperation
Nice-to-have
Independent project coordination and leadership
Key Requirements
Pursuing bachelor or master degree
Major in Metallic Materials Engineering, Polymer Materials Engineering, or Mechanical Engineering and Automation