$155,520.00-298,440.00 usd; not specified; not spe...
Hybrid
External memory and foundry silicon integration
Chip-to-package interaction assessments
Advanced packaging platforms
Intel is shaping the future of technology, pushing forward fields like AI, analytics, and cloud-to-edge technology to improve everyday quality of life
Job Summary
Intel is shaping the future of technology, pushing forward fields like AI, analytics, and cloud-to-edge technology to improve everyday quality of life.
This role leads technical integration of external memory and/or foundry silicon technologies into Intel's advanced packaging platforms, driving comprehensive chip-to-package interaction assessments.
We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and comprehensive benefit programs.
Matching Summary
Intel is shaping the future of technology, pushing forward fields like AI, analytics, and cloud-to-edge technology to improve everyday quality of life.
Salary
$155,520.00-298,440.00 USD; Not specified; Not specified
Skills & Requirements
Must-have
External memory and foundry silicon integration
Chip-to-package interaction assessments
Advanced packaging platforms
Technical program management
Process characterization and improvement
Big data analysis for process issues
Nice-to-have
Thrive in ambiguous environments
Executive audience communication
Strategic platform planning
Key Requirements
BA degree with 6+ years experience or Master's with 4+ years or PhD with 2+ years
3+ years microelectronic packaging process development
3+ years semiconductor packaging assembly integration
3+ years semiconductor technical program management
3+ years managing semiconductor suppliers or customer programs