Sr Engineer, Aptd Bonding / Wafer Thinning

Micron

Multiple Locations
Wafer bonding/debonding experience
Process engineering problem-solving
Technical documentation generation
Micron Technology is a world leader in innovating memory and storage solutions

Job Summary

  • Micron Technology is a world leader in innovating memory and storage solutions.
  • The role involves driving improvements in wafer bonding and thinning performance.
  • Candidates will engage in cross-team interaction for advanced packaging development.

Matching Summary

Micron Technology is a world leader in innovating memory and storage solutions.

Skills & Requirements

Must-have

  • Wafer bonding/debonding experience
  • Process engineering problem-solving
  • Technical documentation generation

Nice-to-have

  • Independent and innovative thinking
  • Fluent in English and Chinese
  • Strong team collaboration

Key Requirements

  • Minimum 3 years semiconductor experience
  • Master's degree or higher in relevant fields
  • Experience with Si grinding/CMP technologies

Work Rights

Not specified

Tailored Resume

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