Semiconductor Process Optimisation Senior Engineer

NUS Enterprise

Singapore, Singapore
**
20+ years semiconductor process engineering experience
Design of experiments doe optimization
Silicon-based photonics process integration
** NUS Enterprise is hiring a Semiconductor Process Optimisation Senior Engineer to enhance semiconductor fabrication processes through innovative methodologies and cross-functional collaboration. The ideal candidate should possess extensive experience in semiconductor engineering, strong analytical skills, and a passion for continuous improvement. **

Job Summary

  • This role focuses on improving yield, performance, scalability, and cost efficiency across semiconductor fabrication processes through data-driven methodologies.
  • The successful candidate will lead process innovation initiatives and drive technology transfer from R&D to manufacturing with optimized process windows.
  • Join a high-impact engineering team at NUS Enterprise to shape next-generation process capabilities in a collaborative and innovative environment.

Matching Summary

Match Score: 75

** NUS Enterprise is hiring a Semiconductor Process Optimisation Senior Engineer to enhance semiconductor fabrication processes through innovative methodologies and cross-functional collaboration. The ideal candidate should possess extensive experience in semiconductor engineering, strong analytical skills, and a passion for continuous improvement. **

Skills & Requirements

Must-have

  • 20+ years semiconductor process engineering experience
  • Design of Experiments DOE optimization
  • Silicon-based photonics process integration
  • Statistical modeling and process capability analysis
  • Python or Origin data analysis proficiency

Nice-to-have

  • Strong publication or patent record
  • Experience with III-V compound semiconductors
  • Advanced semiconductor nodes expertise
  • Cross-functional technical project leadership
  • Passion for driving measurable improvements

Key Requirements

  • Bachelor's, Master's, or PhD in Electrical Engineering, Physics, or Material Science
  • 20+ years of semiconductor process engineering experience
  • Extensive experience with die bonding and advanced packaging methods
  • Hands-on experience with lithography, etch, deposition, implantation, and CMP

Work Rights

Not specified

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