Semiconductor Process Optimisation Senior Engineer
NUS Enterprise
Singapore, Singapore
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20+ years semiconductor process engineering experience
Design of experiments doe optimization
Silicon-based photonics process integration
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NUS Enterprise is hiring a Semiconductor Process Optimisation Senior Engineer to enhance semiconductor fabrication processes through innovative methodologies and cross-functional collaboration. The ideal candidate should possess extensive experience in semiconductor engineering, strong analytical skills, and a passion for continuous improvement.
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Job Summary
This role focuses on improving yield, performance, scalability, and cost efficiency across semiconductor fabrication processes through data-driven methodologies.
The successful candidate will lead process innovation initiatives and drive technology transfer from R&D to manufacturing with optimized process windows.
Join a high-impact engineering team at NUS Enterprise to shape next-generation process capabilities in a collaborative and innovative environment.
Matching Summary
Match Score: 75
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NUS Enterprise is hiring a Semiconductor Process Optimisation Senior Engineer to enhance semiconductor fabrication processes through innovative methodologies and cross-functional collaboration. The ideal candidate should possess extensive experience in semiconductor engineering, strong analytical skills, and a passion for continuous improvement.
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Skills & Requirements
Must-have
20+ years semiconductor process engineering experience
Design of Experiments DOE optimization
Silicon-based photonics process integration
Statistical modeling and process capability analysis
Python or Origin data analysis proficiency
Nice-to-have
Strong publication or patent record
Experience with III-V compound semiconductors
Advanced semiconductor nodes expertise
Cross-functional technical project leadership
Passion for driving measurable improvements
Key Requirements
Bachelor's, Master's, or PhD in Electrical Engineering, Physics, or Material Science
20+ years of semiconductor process engineering experience
Extensive experience with die bonding and advanced packaging methods
Hands-on experience with lithography, etch, deposition, implantation, and CMP