Advanced Packaging Module Development Engineer

Intel Retiree Medical Plan Trust

Phoenix, Arizona, United States
Base: $133,800.00-188,890.00 usd; bonus/equity: st...
Hybrid
Process development and optimization
Equipment capability analysis
Statistical methodologies for manufacturing
Join Intel's Advanced Packaging Technology Development team to drive innovation and shape the future of advanced IC packaging solutions

Job Summary

  • Join Intel's Advanced Packaging Technology Development team to drive innovation and shape the future of advanced IC packaging solutions.
  • Develop and optimize panel level processes and equipment, applying principles of design of experiments to characterize process windows and drive continuous improvements.
  • Intel offers a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and comprehensive benefit programs.

Matching Summary

Join Intel's Advanced Packaging Technology Development team to drive innovation and shape the future of advanced IC packaging solutions.

Salary

Base: $133,800.00-188,890.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Process development and optimization
  • Equipment capability analysis
  • Statistical methodologies for manufacturing
  • Panel level processes development
  • Design of experiments (DoE)

Nice-to-have

  • Data-driven problem solving
  • Collaborative cross-functional environments
  • Continuous learning and improvement
  • Adaptable to fast-paced settings

Key Requirements

  • Bachelor's degree in relevant engineering/science field
  • 4+ years of experience in process development
  • Experience with DoE and statistical data analysis
  • Experience with process characterization and SPC
  • Experience with materials testing and characterization

Work Rights

Not specified

Tailored Resume

Cover Letter