Principal Technologist

Asm

Boise, Idaho, US
On-site
Advanced packaging technology engagement
Customer new product penetration
Module process and equipment improvements
ASM is seeking a Principal Technologist in Boise, Idaho, to lead advanced packaging technology initiatives within the semiconductor field. The ideal candidate will have extensive experience in process development and a strong focus on collaboration and customer engagement

Job Summary

  • Lead advanced packaging technology engagement for key customer new products/applications penetration.
  • Drive module process and equipment fundamental improvements to ensure we meet customer needs and win applications.
  • Build strong cross-functional and matrixed relationships and collaborate with Product Marketing, Product Development, Service Engineering, and others to ensure a positive customer experience.

Matching Summary

Match Score: 85

ASM is seeking a Principal Technologist in Boise, Idaho, to lead advanced packaging technology initiatives within the semiconductor field. The ideal candidate will have extensive experience in process development and a strong focus on collaboration and customer engagement.

Skills & Requirements

Must-have

  • Advanced packaging technology engagement
  • Customer new product penetration
  • Module process and equipment improvements
  • NPI program schedule definition
  • Cross-functional relationship building

Nice-to-have

  • Collaborative culture
  • Positive impact on the world
  • Continuous team development

Key Requirements

  • 15+ years (bachelor) or 12+ years (M.S./Dr.) semiconductor experience
  • Thin Film/PECVD/LPCVD/ALD module process development
  • Strong project management and analytical skills
  • Proven success in building collaborative partnerships
  • Effective English oral and written communication skills
  • Strong leadership qualities

Work Rights

Not specified

Tailored Resume

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