Staff Engineer, Package Reliability

Micron

Taichung, Taiwan
Knowledge of semiconductor packaging processes
Experience in hbm packaging
Strong analytical problem-solving skills
Micron Technology is a leader in memory and storage solutions

Job Summary

  • Micron Technology is a leader in memory and storage solutions.
  • The role involves coordinating package qualification efforts for new products.
  • Candidates will engage in phase gate reviews from design to production release.

Matching Summary

Micron Technology is a leader in memory and storage solutions.

Skills & Requirements

Must-have

  • Knowledge of semiconductor packaging processes
  • Experience in HBM packaging
  • Strong analytical problem-solving skills

Nice-to-have

  • Experience in data analysis and reliability modelling
  • Good written and interpersonal skills
  • Ability to work independently

Key Requirements

  • Minimum 10 years of experience
  • BS degree in Engineering or related field
  • Direct experience in HBM preferred

Work Rights

Not specified

Tailored Resume

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