Process Engineer – Die To Wafer Hybrid Bonding

Applied Materials

Santa Clara, CA, US
Base: $147,000.00 - $202,500.00; bonus/equity: eli...
Hybrid
Die-to-wafer hybrid bonding process development
Thin-die handling and alignment-critical processes
Direct experience on semiconductor equipment
Applied Materials is seeking a Process Engineer specializing in Die-to-Wafer Hybrid Bonding to contribute to R&D efforts in semiconductor and display technologies. The role involves developing and optimizing manufacturing processes while collaborating with a global team in a supportive work environment

Job Summary

  • This role focuses on driving die-to-wafer hybrid bonding R&D for silicon photonics and co-packaged optics applications within the Photonics Platforms Business Group.
  • The engineer will develop novel bonding flows enabling photonic-electronic co-integration, a critical enabler for AI and HPC systems.
  • Candidates will receive hands-on training with state-of-the-art equipment, including the industry's first fully integrated die-to-wafer hybrid bonding system.

Matching Summary

Match Score: 85

Applied Materials is seeking a Process Engineer specializing in Die-to-Wafer Hybrid Bonding to contribute to R&D efforts in semiconductor and display technologies. The role involves developing and optimizing manufacturing processes while collaborating with a global team in a supportive work environment.

Salary

Base: $147,000.00 - $202,500.00; Bonus/Equity: Eligible for bonus and stock award program; Benefits: Comprehensive benefits package including health and wellbeing programs

Skills & Requirements

Must-have

  • Die-to-wafer hybrid bonding process development
  • Thin-die handling and alignment-critical processes
  • Direct experience on semiconductor equipment
  • DOE-driven experiment design and execution
  • Failure analysis and process optimization

Nice-to-have

  • Strong problem-solving skills in R&D
  • Collaboration across multidisciplinary teams
  • Experience with optical interconnect technologies
  • Ability to work independently with minimal supervision

Key Requirements

  • M.S. or Ph.D. in Materials Science, Electrical Engineering, Applied Physics, or related STEM discipline
  • In-depth knowledge of 2.5D/3D integration and bond interface physics
  • Proficiency in statistical analysis tools such as DOE, SPC, and JMP

Work Rights

Not specified

Tailored Resume

Cover Letter