Senor Wire Bonding Manufacturing / Process Development Engineer

Teledynebrownjobshsv

$113,600.00-$151,400.000; not specified; not speci...
Automated wire bonding processes
Process development and optimization
Statistical analysis and doe
The person is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing

Job Summary

  • The person is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing.
  • This role supports production readiness, drives continuous improvement, and ensures process capability, repeatability, and compliance with quality and reliability requirements.
  • The engineer acts as a technical subject matter expert, providing hands‑on support to operators and technicians while collaborating cross‑functionally with Design, Quality, Manufacturing Engineering, and Supply Chain.

Matching Summary

The person is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing.

Salary

$113,600.00-$151,400.000; Not specified; Not specified

Skills & Requirements

Must-have

  • Automated wire bonding processes
  • Process development and optimization
  • Statistical analysis and DOE
  • Root cause and corrective actions
  • Equipment ownership and maintenance
  • Technical documentation creation

Nice-to-have

  • Thrive on making an impact
  • Excitement of being on a winning team
  • Lean manufacturing activities
  • Factory modernization goals

Key Requirements

  • 3+ years of relevant experience
  • Bachelor's degree preferred
  • US Citizen or PERM Resident
  • Proficiency with SPC, DOE
  • Troubleshoot equipment and process issues

Work Rights

US Citizen or PERM Resident

Tailored Resume

Cover Letter