Capillary Underfill Technology Development Module Engineer

Intel Retiree Medical Plan Trust

Kulim, Malaysia
Onsite
Develops assembly processes and equipment
Optimizes manufacturing efficiency
Develops process and equipment specifications
Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies

Job Summary

  • Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
  • Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
  • Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.

Matching Summary

Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.

Skills & Requirements

Must-have

  • Develops assembly processes and equipment
  • Optimizes manufacturing efficiency
  • Develops process and equipment specifications
  • Evaluates silicon and package technologies
  • Ensures manufacturability of physical layout
  • Establishes material specifications
  • Develops new acceleration methods

Nice-to-have

  • AI/ML knowledge
  • Continuous improvement focus
  • Customer/client responsiveness
  • Collaboration with partner engineering groups

Key Requirements

  • Bachelor’s or Master’s degree
  • Research and development experience
  • Statistical design of experiments knowledge
  • Problem-solving techniques knowledge

Work Rights

Not specified

Tailored Resume

Cover Letter