Senor Wire Bonding Manufacturing / Process Development Engineer

785

Base: $113,600.00-$151,400.00; bonus/equity: not s...
Not specified
Automated wire bonding process expertise
Process optimization and doe leadership
Equipment troubleshooting and maintenance
Teledyne Technologies is seeking a Senior Wire Bonding Manufacturing/Process Development Engineer to develop and optimize automated wire bonding processes for microelectronics manufacturing. The role emphasizes hands-on support, collaboration across departments, and a focus on continuous improvement and compliance

Job Summary

  • The person is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing.
  • This role supports production readiness, drives continuous improvement, and ensures process capability, repeatability, and compliance with quality and reliability requirements.
  • The engineer acts as a technical subject matter expert, providing hands‑on support to operators and technicians while collaborating cross‑functionally with Design, Quality, Manufacturing Engineering, and Supply Chain.

Matching Summary

Match Score: 85

Teledyne Technologies is seeking a Senior Wire Bonding Manufacturing/Process Development Engineer to develop and optimize automated wire bonding processes for microelectronics manufacturing. The role emphasizes hands-on support, collaboration across departments, and a focus on continuous improvement and compliance.

Salary

Base: $113,600.00-$151,400.00; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • automated wire bonding process expertise
  • process optimization and DOE leadership
  • equipment troubleshooting and maintenance
  • statistical process control and analysis
  • cross-functional collaboration
  • technical documentation and compliance

Nice-to-have

  • experience in aerospace or defense manufacturing
  • knowledge of MIL-STD-883 and NASA standards
  • MES systems and digital documentation tools
  • strong communication and training skills
  • lean manufacturing and continuous improvement mindset

Key Requirements

  • Must have US citizenship or PERM residency
  • Bachelor’s degree in relevant engineering field preferred
  • 3+ years experience in microelectronics manufacturing
  • Hands-on experience with automated wire bonders
  • Proficiency with SPC, DOE, and statistical analysis

Work Rights

Must have US citizenship or PERM residency

Tailored Resume

Cover Letter