You will be responsible for the design, modeling, layout, post-fabrication assembly, sub-system assembly, and benchtop test of RF integrated photonics (PIC) devices/components, subsystems, and systems in support of research and development programs.
Base: 95,500 USD - 181,700 USD; Bonus/Equity: Not specified; Benefits: Medical, dental, vision, 401(k) match, PTO, etc.
Must-have
Nice-to-have
U.S. citizenship required